A little over a pandemic ago, the first article in this series on statistical analysis mentioned that a fundamental aspect of statistics is that one assumes a mathematical model that describes the distribution of a data set and then uses that model to estimate the probability that a given value or set of values will occur [1]. This allows us, for example, to estimate whether … [Read more...]
Heat Transfer and Pressure Drop Correlations for Manifold Microchannel Heatsinks
Written by: Sevket U. Yuruker, Raphael K. Mandel, Amir Shooshtari and Michael M. Ohadi - Department of Mechanical Engineering, University of Maryland Conventional microchannel cooling has been proven capable of removing high heat fluxes, but usually at significant pressure drops. On the other hand, manifold microchannel systems offer high heat transfer coefficients/heat … [Read more...]
Electrically Conductive Die Attach Adhesive Has Very High Thermal Conductivity
In this video demonstration, learn more about EP3HTSDA-1, a thermally conductive die attach epoxy, and see how easily it dispenses. One component Master Bond EP3HTSDA-1 is formulated primarily for die attach applications. It exhibits a die shear strength of 20-22 kg-f and has a high thermal conductivity of 40-45 BTU•in/ft2•hr•°F [5.7-6.5 W/(m•K)]. “This 100% solids … [Read more...]
Future Trends in LED Driver System Modeling
Introduction A decade ago, the major players in the lighting industry decided to make the transition to digital systems and set the pace in connected lighting. At present, only a few companies can maintain their leadership. As a self-fulfilling prophecy, the lighting landscape changed remarkably, with scattered competitors having access to internet of things (IoT) ecosystems … [Read more...]
Upper Air Room Disinfection with UV-C Luminaire – Metrics and Multi-Domain Modeling Approach
In my previous article, I questioned how our simulation community of experts can contribute in this pandemic time? I am coming back to present examples of contributions. While the general topic of this article is outside the typical scope of Electronics Cooling Magazine, it does illustrate how analysis methods that are discussed here, such as computational fluid dynamics, and … [Read more...]
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