Rogers Corporation announced the latest addition to its RO4000® Series thermoset circuit materials: RO4830™ high-frequency laminates. RO4830 laminates offer 76-to-81-GHz auto radar sensor designers a lower-cost-but-performance-competitive option. Rogers RO4830 laminates are processed by means of standard epoxy/glass (FR-4) circuit fabrication methods, for lower overall … [Read more...]
DuPont Launches New Portfolio of Electronic Thermal Management Solutions
DuPont Electronic Materials has recently announced the launch of a new portfolio of thermal solutions under the brand name DuPont™ Temprion™ thermal management materials. The Temprion™ portfolio is completely non-silicone and currently includes thermal greases, thermal gap fillers, electrically insulating films and adhesive thermal tapes. These new thermal management … [Read more...]
Cooling the DARPA Space Surveillance Telescope (SST)
by MP Divakar, PhD, Stack Design Automation Technical Editor, Electronics Cooling With many nations joining the race of sending satellites out to space, the number of orbiting space debris is increasing year after year. This NASA portal estimates the number of space junk as over 500,000 orbiting earth at speeds of 17,500mph or higher. Most of the half-million plus objects … [Read more...]
Two Part Silicone That Meets NASA Low Outgassing Specifications
Master Bond has recently released its MasterSil 973S-LO, an adhesive, sealant and coating that passes NASA low outgassing tests. Well suited for use in vacuum environments, the MasterSil 973S-LO features a low volume resistivity of 0.004 ohm-cm, and is a silver filled compound that has a thermal conductivity of 9-11 BTU•in/ft²•hr•°F [1.30-1.59 W/(m•K)]. It bonds to metals, … [Read more...]
Surface Temperatures of Electronics Products: Appliances vs. Wearables
by MP Divakar, PhD, Stack Design Automation Technical Editor, Electronics Cooling Online Prior to designing the requisite thermal management solution, engineers routinely calculate the junction temperatures of active and passive components using various methods at their disposal –finite difference grids, lumped parameter models, finite element methods, etc. The junction … [Read more...]
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