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Formula Developed for Heat Transfer Between Near-Field Bodies

 

Alejandro Rodriguez, a researcher at Princeton, and colleagues at the Massachusetts Institute of Technology have come up with a formula that describes the maximum heat transfer between near-field objects in a recent study. Phys.org claimed that “with this new formula, engineers will know how much more performance can be squeezed out of their structural and material … [Read more...]

New Power Electronics Will Allow Army Vehicles’ Electronics to Operate at High Temperatures

 

The US Army has awarded GE Aviation with a contract to develop silicon carbide-based power electronics that will allow high-voltage, next-generation ground vehicles to operate at higher temperatures. "The US Army's implementation of [this technology for] more electric ground vehicles, facilitates significant improvements in size, weight and power for high temperature … [Read more...]

New Particle Creates Less Heat, Saves Energy

 

Researchers have discovered a new particle that doesn’t consume a lot of energy, and thus doesn’t require an elaborate cooling system. It is called the Weyl fermion, a particle that only exists inside materials and “moves through materials practically without resistance,” according to Nanowerk.com. In contrast to today’s computer chips relying on “electrons which are always … [Read more...]

New TIMs That Offer High Thermal Conductivity

 

Chomerics Europe, a division of Parker Hannifin, has recently revealed a new thermal interface material with high thermal conductivity and very low deflection force designed for effective heat dissipation in telecommunication, IT, and automotive applications, THERM-A-GAPTPS60. “THERM-A-GAP TPS60 comprises a soft (Shore 00-35) silicone matrix filled with thermally conductive … [Read more...]

Registration for Thermal Conference Opens

 

ITherm 2016 has now opened registration for the conference running from May 31 to June 3, 2016 at the Cosmopolitan Hotel in Las Vegas, Nevada. ITherm 2016 is the leading international conference for scientific and engineering exploration of thermal, thermo-mechanical and emerging technology issues associated with electronic devices, packages, and systems. According to the … [Read more...]

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