Silicon-based technology developer Dow Corning has released new dispensable thermal pads for more cost-effective thermal management in LED lighting applications. The new dispensable thermal pads “enable LED lamp and luminaire manufacturers to quickly and precisely print a layer of thermally conductive silicone compound in controllable thicknesses on complex substrate shapes … [Read more...]
Thermal Adhesive Tape for Application to Unprocessed PCBs
Thermal management materials manufacturer Universal Science has introduced a new thermal adhesive tape designed to be applied to FR4 or insulated metal substrate printed circuit boards (PCBs) prior to processing as a replacement for mechanical fixings. Featuring a thermal conductivity of 2.0 W/mK and a breakdown voltage (electrical isolation) of 4 kV AC, Bondline 2000-REFLOW … [Read more...]
Discovery Could Change Textbook Models on Heat Transfer
A new discovery in the physics of heat transmission along nanowires could rewrite the models of heat transfer in current textbooks and bring major changes to the electronics industry. Researchers at the National Taiwan University’s Center for Condensed Matter reportedly found ballistic thermal conduction by phonons at room temperature along silicon-germanium nanowires. While … [Read more...]
Phase-Change Material Offers Alternative Thermal Management Solution to Thermal Grease
Universal Science, a manufacturer of thermal management materials, has introduced UniPhase 3500, a new phase change material that combines a high level of thermal performance and a thin bond line into an ideal solution for designs where a high degree of heat transfer is required over large surface areas. According to the company, UniPhase 3500 is a silicone-free material that … [Read more...]
Liquid Silicone Adhesive Offers High Thermal Conductivity for Bonding Electronic Components
The Bergquist Company, a manufacturer of high-performance thermal management materials, has released Liqui-Bond SA 3505, a two-component, liquid silicone adhesive ideal for power supplies and discrete applications. With a high thermal conductivity of 3.5 W/m-K, Liqui-Bond SA 3505 offers a thermal conductivity previously unavailable in a structural adhesive, the company said. … [Read more...]
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