On June 26 Carl Zweben presented a live webinar on Advanced Composite Thermal Management Materials and Applications. Overview: This presentation covers key advanced composite thermal management materials and applications. We also look at current and future advanced reinforcements, such as diamond particles, carbon nanotubes, graphene and graphite nanoplatelets. The … [Read more...]
Laminate Material Features Improved Thermal Reliability For Higher Maximum Operating Temperatures
The Advanced Circuit Materials Division of Rogers Corporation, a manufacturer of materials and components for consumer electronics, has released RO4360G2 laminate, a high frequency laminate material featuring improved thermal reliability for higher maximum operating temperatures over its predecessor, RO4360 laminate. According to the company, ideal applications for RO4360G2 … [Read more...]
Manufacturing Plant for Nanoceramic-Aluminum Substrate Technology to Be Built in Haverhill
Electronics thermal management provider Cambridge Nanotherm has announced plans to build its first prototype manufacturing plant in Haverhill, UK following the award of £250,000 in matched funding from the UK Innovation Agency - Technology Strategy Board (TSB). The company plans to use the new facility to further develop its new nanoceramic-aluminum substrate technology, and to … [Read more...]
DuPont Increases Thermal Substrate Production to Accommodate Demand
DuPont Circuit & Packaging Materials, part of DuPont Electronics & Communications, announced earlier this week that it has increased production at its Hsinchu, Taiwan facility by more than seven times the previous amount to better accommodate demand for its CooLam thermal substrate products. DuPont CooLam thermal substrates are designed to help dissipate heat in LED … [Read more...]
Two Thermally Conductive Compounds Added to TIM Product Line
Silicones supplier Dow Corning has added two new products—Dow Corning TC-5622 and TC-5351 Thermally Conductive Compounds—to its line of thermal interface materials. Offering good thermal performance and improved resistance to hardening or dry-out in end-use applications, Dow Corning’s TC-5622 thermally conductive compound is ideal for applications where heat must be dissipated … [Read more...]
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