Epoxies, Etc., a manufacturer of thermal management compounds, epoxies and adhesives, has released a new silicone potting and encapsulating compound. According to the company, the 50-1952 is formulated for rapid thermal transfer away from heat-generating electronic devices. The new silicone compound is made of flexible material to protect electronics from vibration and impact … [Read more...]
Nanotechnology Copper-Based Solder Material for Applications in Military and Commercial Systems
Scientists at the Lockheed Martin Space Systems Advanced Technology Center (ATC) in Palo Alto, California have developed CuantumFuse, a nanotechnology copper-based electrical interconnect material for applications in aerospace, military and commercial systems. According to the company, the creation of the new solder material is a result of an ongoing effort to phase out … [Read more...]
New Porous Metal Technology for Thermal Management in Electronic Components
U.K. startup Versarien will provide a demonstration of porous metal technology and its potential uses in thermal management products during the Electronica exhibition in Munich, Germany this week. The startup was created after CEO Neil Ricketts began collaborating with researchers at the University of Liverpool to examine the use of porous metals for strength-to-weight ratio … [Read more...]
Research Suggests Ferroelectric Crystals May Assist with Computer Chip Heat Regulation
Researchers at the Carnegie Institution in Washington, D.C. have discovered a new, efficient way to extract heat using ferroelectric crystals. The crystal materials exhibit an electrical polarization in the absence of an electrical field that can be reversed by applying an external electrical field, resulting in a significant temperature change. Ronald Cohen, staff scientist … [Read more...]
Choosing Adhesives for Withstanding Thermal Cycling Stresses
Many engineers have traditionally designed bonding applications to withstand extreme temperatures using the idea that substrate materials and adhesives with similar coefficients of thermal expansion (CTE) will, at a given temperature, change size at the same rate. However, the difficulty of finding substrates and adhesives that have compatible CTEs and meet all application … [Read more...]
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