Applied Nanotech has developed a way to make some solar technology cheaper, which could reduce the cost of solar panels. Solar panels are made up of a collection of solar wafers, and the company is attempting to make solar technology cheaper by creating a thinner silicon wafer, and a more efficient way to apply the metallic ink without breaking the wafer. Applied Nanotech has … [Read more...]
Gap Filler Has Thermal Conductivity of 1.6 W/m-k
T-Global Technology Ltd’s new gap filler, L37-5S, has a Shore OO hardness of 3 and a thermal conductivity of 1.6 W/m-k. It is specifically aimed at consumer electronics and LED applications where optimum performance is critical for design success. As with other family members in the L37 series the product is available in a range of thicknesses, with or without an adhesive … [Read more...]
Wide Input Range 400 Watt DC DC Converter
Calex Mfg. Co., Inc.’s new 400 Watt FBW DC DC Converter Series offers a 9-36 VDC and 18-75 VDC input range in a 4.6" x 2.4" x 0.55" high package. The wide input range provides a solution for industrial and military COTS applications that have a wide input voltage requirement. The FBW is housed in a metal case and encapsulated with a thermally conductive potting compound for … [Read more...]
University Receives Grant for Silicon-Based Technologies Research
The University of Warwick Department of Physics has been awarded a five-year £1.7 million grant for “Creating Silicon Based Platforms for New Technologies.” The initiative will bring in new technologies ranging from energy harvesting to “cooltronics,” enabling zero-power electronics and could be key to combating global climate change. The £1.7 million Platform Grant from the … [Read more...]
Non-Flowing Silicone-Based Thermal Grease
Fujipoly’s new Sarcon® SG-26SL silicone-based thermal grease delivers a thermal conductivity of 2.6 W/m°K while exhibiting minimal bleed and evaporation characteristics. The non-flowing consistency of Sarcon® SG-26SL makes the grease ideal for power converter and high-performance CPU applications that have bond lines as small as 1 mil. The compound is easy to apply as well as … [Read more...]
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