Power on an IC package, measure the resulting transient response of the junction temperature and from that infer a wealth of information about the structure of the package that the heat has to flow through. Such a methodology is at the heart of the Mechanical Analysis Division’s T3Ster(pronounced “trister”) product. Some simulation software vendors pitch their … [Read more...]

Here at the Mechanical Analysis Department we love FloTHERM and we love developing FloTHERM to ensure it keeps up with the needs and follows the trends of the electronic thermal simulation market. The latest release of FloTHERM, V9.1, has a wealth of features and benefits that continues to ensure it’s position as the #1 CFD based software tool used for such purposes. Here … [Read more...]

Simulation has, to date, focused primarily on the prediction of an operating state that is compared to a design acceptable state to judge the compliance of that design. From an electronics cooling perspective that state is often taken as the operating temperature of packaged ICs, most commonly a case (Tc) or junction (Tj) temperature. FloTHERM has, over the last 21 years, … [Read more...]

In my last post I pointed out a very obvious mistake in Blue Ridge Numerics’ “CFD Comparison Chart” of March 19th this year, which incorrectly stated that FloEFD can only handle incompressible sub-sonic flows. The reason I highlighted this as the most obvious mistake in the “CFD Comparison Chart” is that FloEFD can trace its history back to the Russian Aerospace Industry in the … [Read more...]

The internet is big. It’s not sentient yet, though Robert Swayer has written a compelling story of how it might ‘Wake‘. In fact it’s far from intelligent at all. Banal comments about “how we ever managed without it” will age so quickly that future historians will assume a typo, more intelligence than we currently have and take the phrase to … [Read more...]