Electronic products, and products that contain electronics, are typified by being constructed of 100s if not 1000s of individual parts. A CPU alone is the most complex manufactured product on earth as demonstrated in this excellent picture story on Tom’s Hardware. From the IC through package, PCB and chassis, items are glued, cured, soldered, screwed and assembled into … [Read more...]

FloTHERM V10 is a major release that marks 25 years as the leading electronics thermal simulation tool. This series will introduce the top 10 features that we’ve delivered, hopefully giving some insights not just on the features themselves, but also on the background as to how and why we’ve developed them. To start with let’s look at the most obvious change, a … [Read more...]

Late in 1988 two key employees of CHAM (Concentration Heat And Momentum Ltd.), the first commercial CFD vendor and at the time market leader, left to set up a new type of CFD company. Recognising the opportunity to package CFD in focussed, highly automated and application specific products, David Tatchell and Harvey Rosten started to develop what would become FloTHERM. A CFD … [Read more...]

Two different package styles, two very different thermal responses when a extruded plate fin heatsink is placed on each. At the very least a FloTHERM simulation can be used to observe the thermal behaviour of a product concept, beyond that it can be used to understand *why* the thermal behaviour is what it is. … [Read more...]