Surface Mount Techniques (SMT) announces stencil/screen printers specifically designed for thermal grease applications. Highly concentrated heat sources found in ever shrinking electronic designs have increased the demand for better heat dissipation. The demand is seen across many industries: power electronics, electric vehicles (EV), ever shrinking handheld devices and … [Read more...]
Thermal Gap Fillers Combine High Performance, Low Pricing
New TP-S30 thermal interface pads from MH&W International provide 3.0 W/mK of thermal conductivity between hot components and heat sinks at lower costs than competing gap filler materials. Pads of TP-S30 thermal gap fillers are soft and compliant for easy compression and filling of air gaps between mounting surfaces to optimize heat transfer. Applications for these gap … [Read more...]
Green Fan Tray Operates When Ambient Heat Reaches 88˚F
Gardtec Incorporated has released a Green Fan Tray assembly, designed around the Gardtec Green Fan Cord, which allows the fan trays to operate only when the system ambient heat reaches 88 degrees Fahrenheit. The fan trays are available with 3/6/9 AC fans, both in 115 and 230 volts, making the fan trays highly suitable for numerous applications. The standard fan tray is designed … [Read more...]
Light Tack Adhesive Eases Fitting of Thermal Interface Pads
MH&W International now provides U 90 silicone-free thermal interface materials with a new light tack adhesive to provide high thermal conductivity where contamination threats prevent the use of silicone-based thermal pads, and allow their easy positioning between components and heat sinks. MH&W’s Keratherm U 90 thermal interface material is a ceramic-filled … [Read more...]
Embedded Wafer-Level-Packages
Yole Developpement has released its new report on Embedded Wafer-Level-Packaging. This analysis covers both Fan-Out WLP technology development and Chip embedding into PCB laminated substrates. These two infrastructures are emerging at the same time and ramping to high volume production. Key features of the report “Embedded Wafer-Level-Packages: Fan-out WLP / Chip Embedding in … [Read more...]
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