Introduction Modular light pipe systems, specifically Bivar's new MLPS, communicate more data these days, it is very difficult if you do not have a few LEDs on the panel. For example, in a control system environment, like in AI, such as echo devices and other similar devices. Also in robotics, there's a lot of indication available, which does let you see the status on the … [Read more...]
Thermocouple Basics Part 1: Advantages to Multi-Channel Isolated Thermocouples
Multichannel isolated thermocouples is a system that RECOM developed for use in a test lab. We will discuss how this will be useful for others to know the advantages and disadvantages of such a system. What is a thermocouple? It is two different types of metals that are joined together. In figure 1, we have a metal that's called chromel, and another one called alumel. When … [Read more...]
Duocel® Metal Foam Heat Exchangers
Introduction As power-component technology advances and smaller packaging is required, thermal-management issues threaten to limit the performance of devices. As power dissipation rises, the inability to cool them may force designers to de-rate the devices’ performance by reducing current or switching speed and/or employing higher-voltage devices that are less efficient and … [Read more...]
Sheetak Announces Product Line Expansion with CENTUM® C3 Multi-Stage Cooler Based on Novel Patented Thermoelectric Device Structures
CENTUM® C3 Chips are designed for higher performance low profile architecture of solid-state thermal management systems that is not possible with current designs January 10, 2023 AUSTIN, TX--Sheetak is expanding their flagship CENTUM® product line, based on newly patented thermoelectric device structures, that offer the highest temperature difference with significant … [Read more...]
Arieca Announces an Agreement to Develop a Liquid-Metal-Based Thermal Interface Material for Power Modules in the Electric Vehicle (xEV) Segment
May 17, 2022 8:00 AM Eastern Daylight Time PITTSBURGH--(BUSINESS WIRE)--Arieca, a leader in liquid-metal-based Thermal Interface Materials (TIM), entered into a joint research agreement with ROHM Co., Ltd., a leading provider of power semiconductor devices for the xEV market, to develop next-generation TIM using Arieca’s Liquid Metal Embedded Elastomer(LMEE) Technology. This … [Read more...]
