Global technology leader Laird has improved its advanced PC Series Power Cycling thermoelectric module (TEM) for applications that require high reliability and high volume thermal cycling between multiple temperature set points. The enhanced PC Series is now proven to perform more than 1-million temperature cycles, extending the mean time between failure (MTBF) in molecular … [Read more...]
Custom Liquid Cooling Systems Optimize Particle Accelerators Performance
Global technology leader Laird has developed self-contained liquid cooling systems (LCS) that deliver optimal temperature stabilization for more precise temperature control in particle accelerators like linear accelerators (LINACs) and cyclotron systems. LINACs and cyclotrons increase the kinetic energy of particles for use in a variety of applications, ranging from scientific … [Read more...]
Thermally Conductive Laminate Material for Demanding PCB Applications
Ventec International, a world leader in the production of polyimide & high reliability epoxy laminates and prepregs, has added to its extensive thermally conductive laminate and prepreg range with the launch of the VT-5A2, a next generation best-in-class, high Tg thin-core and prepreg material. VT-5A2 is designed for the world's most thermally demanding PCB (Printed … [Read more...]
Advanced ETRI 120-mm EC Axial Fan With Winglet-Style Blades Introduced
The new ETRI Model 125E electronically commutated (EC) axial cooling fan recently introduced by Rosenberg is easier to specify, performs better and offers longer life than competitive products. Its advanced design makes it a perfect choice for VFD cooling, electronic cabinet cooling and small refrigeration applications. The compact 120x120x38 mm ETRI-brand fan features a … [Read more...]
New Laminates Introduced for 5G and Other Millimeter Wave Applications
Rogers Corporation is pleased to introduce CLTE-MW™ laminates. These laminates are ceramic filled, woven glass reinforced PTFE composites. CLTE-MW laminates were developed to provide a cost effective, high performance material for the circuit designer. This unique laminate system is well suited for applications that have limitations in thickness due to either physical or … [Read more...]
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