Yesterday, during the 2015 IEEE ECCE conference and exposition in Montréal, Canada, Mersen presented the R-Tools GEN III. Mersen will show the redesigned interactive 3D Thermal Heatsink Modeling simulation software today, Sept. 22, as well. “R-Tools Gen III is a free on-line simulation software that allows users to model the optimum air cooled heatsink solution tailored to … [Read more...]
Two Phase Cooling System for Data Centers
Ebullient introduces a two phase cooling system for data centers - the Ebullient Cooling System (ECS). It can cool up to 12 heat sources in series in a continuous loop while maintaining a device temperature of +/-2 degrees Celsius. It also offers flexible tubing which allows the system to adapt to hardware without modification. The cooling system “is composed of Ebullient’s ES … [Read more...]
Non-drip Epoxy Paste Cures Optically Clear
Master Bond Inc. introduces the Master Bond EP21NDCL - a new two component non-drip epoxy paste that cures optically clear in thin sections. It is ideal for bonding, coating and sealing applications in aerospace, electrical, opto-electronic and specialty OEM industries. The Master Bond EP21NDCL bonds well to plastics, rubbers, glass, metals, ceramics and other materials and it … [Read more...]
Three New Liquid Cooling Patent Issued – Company Reaches 50th Patent
CoolIT Systems, Inc. announced the U.S. Patent and Trademark Office has granted the company three new patents for liquid cooling. With these, CoolIT Systems has reached its 50th patent milestone. The three newly issued patents include USPTO 9057567 Microchannel Coldplate, USPTO 9052252 Leak Detection System and USPTO 9055697 Air Conditioning System Control. “USPTO 9057567 … [Read more...]
New Dispensable Thermal Pads Now Available in Europe
Ellsworth Adhesives Europe, a distributor of adhesives and specialty chemicals, has announced the release of Dow Corning’s newest series of dispensable thermal pads into the European market. The new dispensable thermal pads are specially designed for the high performance demands of the electronics market. This innovative technology provides a cost-effective thermal management … [Read more...]
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