InTEST Thermal has released a new mobile temperature control system for high-speed thermal testing of electronics, sensors and assemblies. The Thermostream ATS-535 brings temperature to the test site by directing a stream of cooled or heated air, quickly reaching temperatures between -60 to +225°C. Highly mobile and capable of functioning without the need for an external air … [Read more...]
New Fan Delivers High Static Pressure and Energy Reduction
Sanyo Denki Co., Ltd. has introduced the new San Ace 92 DC fan to its DC fan lineup. Measuring 92 × 92 × 38 mm, the new fan delivers the industry’s highest static pressure and energy reduction, the company says, offering cooling performance equivalent to that of three conventional products in series. The San Ace 92 9HV type is ideal for use in servers, data storage systems, … [Read more...]
Hybrid Liquid-Air-Cooled Heat Sink for Extreme Environments
CoolClouds, Inc. has announced the availability of a new class of heat sinks for use in high performance computers or extreme environments starting mid-Q1 2014. According to the company, SuprCool-PC is the first “in-chassis” heat sink to cool more than 300w in the latest Intel and AMD processors without hot spots at 65°C case temperature in 25°C ambient. Comparable in size to … [Read more...]
Highly-Conformable Gap Filler Pad with Reinforced Mesh Center
Fujipoly America Corporation has released its new Sarcon25GR-T2d thermal interface material, a soft, highly-conformable gap filler pad with a reinforced mesh center ideal for applications that require a thermal interface bridge across larger surface areas. Once installed, the TIM delivers a thermal conductivity of 1.5 W/m°K per ASTM D2326 and a thermal resistance of 0.40 … [Read more...]
Boron Nitride Filler for Thermally Conductive Dielectric Plastic Compounds
Saint-Gobain Ceramic Materials has released its new CarboTherm boron nitride thermal management fillers for use in thermally conductive, dielectric plastic compounds. The new boron nitride fillers will be on display December 10-11 at the Compounding World Forum 2013 in Philadelphia, Penn., USA. “Boron nitride, unlike other ceramics, is soft and non-abrading, enabling longer … [Read more...]
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