Dow Corning, a developer of silicon-based technology, has introduced new Dow Corning Dispensable Thermal Pads for use in LED, data server, telecommunications equipment and transportation thermal management applications. “Compared to traditional fabricated thermal pads, new Dow Corning Dispensable Thermal Pads offer the potential for broader design latitudes, simplified … [Read more...]
New CFD Software Update Offers Efficient Handling of Advanced Designs
Thermal simulation and analysis products supplier Mentor Graphics Corp. has released the next generation of its FloTHERM computational fluid dynamics software program with the addition of a new native Windows graphical user interface (GUI) to handle pre-processing and large models with ease for advanced electronic designs. According to the company, the new version includes a … [Read more...]
Connectors for Liquid Cooling Applications
Colder Products Company, a provider of quick disconnect couplings and fittings for plastic tubing, has released the new LQ6 series connectors. Designed specifically for liquid cooling applications requiring multiple connect and disconnect cycles, these specialized couplings deliver reliability, security and ease-of-use in cooling applications where a drip-free connection is … [Read more...]
Flexible Thermal Absorbing Films Boost Heat Dissipation in Small Electronics
Manufacturing company Henkel has released Loctite TAF, a new thermal absorbing film designed to address the heat management challenges associated with small but high-functioning handheld electronic devices. “Managing the intense heat generated by today’s handheld products is one of the biggest challenges facing device designers today,” Jonathan Rowntree, vice president of … [Read more...]
Sony Releases Source Code for Thermal Management Solution
Consumer electronics provider Sony has released the source code for Thermanager, a thermal management solution developed for and used in the company’s Android Open Source Project (AOSP) for Xperia projects. The source code is available through the Sony channel on GitHub. “Since the first release of Android Open Source Project (AOSP) for Xperia devices, thermal management for … [Read more...]
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