The Advanced Circuit Materials Division of Rogers Corporation, a manufacturer of materials and components for consumer electronics, has released RO4360G2 laminate, a high frequency laminate material featuring improved thermal reliability for higher maximum operating temperatures over its predecessor, RO4360 laminate. According to the company, ideal applications for RO4360G2 … [Read more...]
Heatsink System with Modular Cooling Benefits Released
Ohmite Manufacturing, a provider of thermal solutions and resistors for high current, high voltage and high energy applications, has released the high-performance C40 heatsink system with modular cooling benefits. “Designed to provide engineers with a variety of cooling options, the C40 heatsinks feature flexible board mounted modular assembly that can be used in conjunction … [Read more...]
Counter-Rotating Fans for High-Density Electronic Enclosures
Thermal solutions provider JMC products has released two new counter-rotating fans measuring 40x50x32mm and 40x50x38mm for high-density 1U servers, power supplies and high-density electronic enclosures. Both fans feature a speed of 10,200 rpm and pulse width modulation (PWM) control for both motors individually or simultaneously. … [Read more...]
PMIC Helps Reduce Thermal Stress of Smartphone and Tablet Processors
Patented design enables board designers to place the new AS3721 PMIC and applications processor further apart to reduce hotspot intensity. Ams AG, a provider of high performance analog ICs and sensors, has introduced the AS3721, a power management IC with a remote-feedback circuit that helps manage the thermal stress of applications processors in space-constrained … [Read more...]
Manufacturing Plant for Nanoceramic-Aluminum Substrate Technology to Be Built in Haverhill
Electronics thermal management provider Cambridge Nanotherm has announced plans to build its first prototype manufacturing plant in Haverhill, UK following the award of £250,000 in matched funding from the UK Innovation Agency - Technology Strategy Board (TSB). The company plans to use the new facility to further develop its new nanoceramic-aluminum substrate technology, and to … [Read more...]
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