DuPont Circuit & Packaging Materials, part of DuPont Electronics & Communications, announced earlier this week that it has increased production at its Hsinchu, Taiwan facility by more than seven times the previous amount to better accommodate demand for its CooLam thermal substrate products. DuPont CooLam thermal substrates are designed to help dissipate heat in LED … [Read more...]
Two Thermally Conductive Compounds Added to TIM Product Line
Silicones supplier Dow Corning has added two new products—Dow Corning TC-5622 and TC-5351 Thermally Conductive Compounds—to its line of thermal interface materials. Offering good thermal performance and improved resistance to hardening or dry-out in end-use applications, Dow Corning’s TC-5622 thermally conductive compound is ideal for applications where heat must be dissipated … [Read more...]
Web-Based Heat Transfer Calculator Launched
Morgan Advanced Materials, a manufacturer of advanced ceramic components, assemblies and related products, has launched Heat Flow, an online steady-state heat transfer calculator. Compatible with most computer operating systems and web browsers, the Heat Flow application comes pre-loaded with almost 400 products offered by Morgan Advanced Materials; other materials can be … [Read more...]
UV/Wet Location-Rated Cooling Fans
NMB Technologies Corporation has announced the availability of UV/Wet location-rated cooling fans for OEM applications. While the AC axial 4715HS Series and the 5915PC Series are already available potted, the new IP-rated UV/Wet location models have been certified to UL-507 for operation in a variety of environmental conditions, including water spray, humidity conditioning, … [Read more...]
World’s First Liquid-Cooled Smartphone Released
Japanese electronics maker Nippon Electronics Corporation (NEC) may have taken a step towards raising the current limit on smartphone processing capabilities with the company’s unveiling of the world’s first liquid-cooled smartphone earlier this month. While more effective cooling methods continue to be developed to combat larger heat loads in high-end computers, current … [Read more...]
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