Scientists at the Lockheed Martin Space Systems Advanced Technology Center (ATC) in Palo Alto, California have developed CuantumFuse, a nanotechnology copper-based electrical interconnect material for applications in aerospace, military and commercial systems. According to the company, the creation of the new solder material is a result of an ongoing effort to phase out … [Read more...]
New Porous Metal Technology for Thermal Management in Electronic Components
U.K. startup Versarien will provide a demonstration of porous metal technology and its potential uses in thermal management products during the Electronica exhibition in Munich, Germany this week. The startup was created after CEO Neil Ricketts began collaborating with researchers at the University of Liverpool to examine the use of porous metals for strength-to-weight ratio … [Read more...]
Thermoplastic Polyester for Thermal Management in LEDs and Electronic Components
Science-based company Royal DSM has released PET XL-T, a thermoplastic polyester for thermal management in LED lighting systems and automotive electronics components. According to the company, Arnite PET XL-T was developed as an alternative to metals and other high heat resistance (HHR) materials commonly used in automotive electronic applications. The new polyester is based … [Read more...]
Thermally Conductive Liquid Material Designed for Low Component Stress Applications
Electronic components provider Bergquist Company has released Liqui-Form 2000, a liquid formable material with high thermal conductivity designed for applications requiring low component stresses during assembly and ease of rework. Liqui-Form 2000 requires no curing, mixing or refrigeration and has a low volumetric expansion, stable viscosity and natural tack. According to … [Read more...]
New Version of LCP with Additional Fan Option Moves Air More Efficiently
Rittal Corporation, a manufacturer of industrial and IT enclosures, racks and accessories, has released a new version of the company’s Liquid Cooling Package (LCP) with the option of additional fans for moving air more efficiently and with less effort. According to the company, the new version of the LCP “makes the cooling solution more scalable, improves redundancy and reduces … [Read more...]
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