Laird Technologies, a manufacturer of performance-critical components and systems for advanced electronics and wireless products, has recently released the WL Series Liquid to Heat Exchanger Systems product line for use in demanding thermal management applications on the market. According to the company, the WL Series are designed to remove large amounts of heat from densely … [Read more...]
High-Performance Polyester Compound for LED Display Screen Applications
Solvay Specialty Polymers USA has released Lavanta 5115 WH 011, a high-performance polyester for heat and light stability in LED display screens. According to the polymer company, the new product was created in response to the growing trend among television manufacturers of using fewer LEDs in products to reduce cost. Lavanta 5115 WH 011 is a 15 percent glass fiber-reinforced … [Read more...]
Thermal Management Compound for LED Heat Sinks
PolyOne Corporation reports that Finland-based LED lighting systems maker Kruunutekniikka Oy has chosen its Therma-Tech thermal management compounds to replace aluminum in the lighting systems maker’s Coolics LED light fixtures. Aluminum is the traditional material for many LED heat sink applications. According to Holger Kronimus, general manager of the PolyOne Corporation’s … [Read more...]
Polycarbonate Replaces Aluminum in Cooling Elements for LED Thermal Management
With the demand for polycarbonate for the production of LED lighting systems growing, Bayer MaterialScience has been steadily expanding its product range to include injection molding and extrusion granules as well as semi-finished film and sheet products. The latest list of company product developments includes polycarbonates with particularly high thermal conductivity for … [Read more...]
Thermally Conductive Epoxy System for Bonding Heat Sinks in Electronic Assemblies
Aremco Products, Inc., a developer of technical ceramics, adhesives, coatings and sealants, has released Aremco-Bond™ 860, a thermally conductive epoxy system developed for bonding heat sinks and fins used in heat exchangers and electronic assemblies. Aremco-Bond™ 860 is comprised of a ratio of one-part base resin to one-part activator by weight and can be used for … [Read more...]
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