The C degree Flow™ strip from Telect simplifies the managing of data center rack temperatures and increases cooling efficiencies. Using the strip's inherent and bold color-shifting properties, a technician can easily assess data center temperatures and be assured that all is cool. Additionally, temperatures across a rack can be increased by knowing where the cold air is going, … [Read more...]
Microblower Based on Piezoelectric Technology
Murata Americas announced the launch of a microblower that uses a piezoelectric diaphragm, which vibrates up and down when a sine wave voltage is applied. The vibrations force air into the microblower and out through a nozzle on the top of the device. Used as an air pump and capable of creating a high air pressure flow, the pump is ideally suited to shorten the duration … [Read more...]
Improved Thermal Management in Power Semiconductors with LL Packages
StratEdge Corporation, high-performance semiconductor package maker for microwave, millimeter-wave, and high-speed digital devices, launched the LL family of high-power laminate packages. The LL leaded laminate copper-moly-copper (CMC) base packages dissipates heat from high-power compound semiconductor devices, such as gallium nitride (GaN), gallium arsenide (GaAs), and … [Read more...]
Liquid Dispensed Thermal Interface Material Filler
The Bergquist Company introduced Gap Filler 1000SR, a two-component, room temperature cure, liquid-dispensable thermal interface material that features slump resistance. As dispensed, the material is designed to remain in place and maintain its shape on the target surface, allowing for flexibility in component orientation during assembly. As cured, the soft elastomer provides a … [Read more...]
New Thermo-Fluid Simulation Software for Power and Energy Markets
Mentor Graphics Corporation announced the Flowmaster(R) Power and Energy version for system level thermo-fluid simulation. This new product provides a two-phase solution modeling the phase change from liquid to vapor for steam generation or from vapor to liquid when steam is consumed. The software introduces a complete steam/water Rankine Cycle simulation capability for the … [Read more...]
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