National Instruments announced that Lockheed Martin will integrate NI PXI modular instrumentation and platform products into the U.S. Navy’s electronic Consolidated Automated Support System (eCASS) automated test equipment family. The eCASS test stations replace the existing CASS program as the U.S. Navy’s core test system for on-ship and onshore electronic subassembly … [Read more...]
Two New Sizes of Electronically Commutated Axial Fans
Rosenberg USA has introduced two new models of electronically commutated axial fans. The new fans feature finned blades with a special pitch that increases fan efficiency. The 500 mm model can deliver up to 6,000 CFM of airflow. The 560 mm model offers a top airflow of 7,000 CFM. The finned blade design also helps reduce fan noise. Applications for Rosenberg EC axial fans … [Read more...]
New Panel Coolers Decrease Noise Level
Nex Flow™ Air Products introduces a simple and inexpensive solution to heat related problems in Industrial Control Enclosures while addressing the increasing concern about noise levels in the work environment. Silent X-Stream ™ Frigid –X™ Panel Coolers are now available with electronic control to conserve compressed air and set the desired temperature in the control … [Read more...]
Thin-film TEC Improves Cooling Performance
Nextreme Thermal Solutions announced the availability of new thin-film thermoelectric cooling products that offer 55°C of cooling performance at an ambient temperature of 25°C. This new level of performance translates to improved cooling efficiency, lower input power requirements, and greater opportunities for solving thermal issues in electronics, photonics and avionic … [Read more...]
New Family of Highly Thermally-Conductive Bonding Materials
Applied Nanotech Holdings, Inc. has unveiled a new family of highly thermally-conductive bonding and printed materials called THERCOBOND™ for power electronics and photonics applications. THERCOBOND™ materials are specially designed for power electronic device packaging and dielectric coating, with an optimal combination of thermal conductivity, thermal diffusivity, thermal … [Read more...]
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