A team of engineers at IBM's T.J. Watson Research Center in Yorktown Heights, N.Y. has developed an automated manufacturing process for graphene-based radio frequency transistors. Until now, RF transistors made from graphene were one-off products of a laborious process. The IBM team came up with a vapor-deposition method that observers say is compatible with common chipmaking … [Read more...]
Internal Combustion Used to Make Metal Oxide Thin-Film Electronics
As amorphous silicon electronics reach their physical limits, researchers at Northwestern University have figured out a way to make amorphous oxides cheaply and reliably. Amorphous oxides are faster than amorphous silicon and also easier to use in devices such as roll-up displays. The researchers found that adding a chemical such as urea to the thin-film metal-oxide solution … [Read more...]
Revolutionary New LED Bulb Aims for Prestigious L Prize
Lighting Science Group Corporation and Prescriptions Innovators, LLC have developed a high output and low cost 60-watt replacement LED bulb, and will submit it for testing to win the Bright Tomorrow Lighting Prize (L Prize) competition. The bulb design is based on patented and patent-pending technologies developed by both companies. The Energy Independence and Security Act of … [Read more...]
Talk Tackles Challenges of LED Test Standards
Defining thermal resistance for LEDs is important as some LED vendors neglect the effect of radiant flux in their calculations, which results in better data than is actually achieved in the field, noted Mentor Graphics’ András Poppe, PhD, in a recent presentation at MEPTEC’s The Heat is On event. Still another example where calculations need to be carefully weighed is … [Read more...]
Connector/Decoupler Integrated in a Heat Sink
United States Patent no. 7,898,078, issued on March 1, was assigned to International Business Machines Corp. Two sets of conductor fins are formed on a topmost surface of stacked semiconductor chips are electrically isolated from each other and function as radiators that dissipate heat from the stacked semiconductor chips. Conductive wiring structures are formed on each set of … [Read more...]
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