Thermal Engineering Associates (TEA) is partnering with engineering services firm, Package Science Services (PSS) to provide measurement, modeling and simulation of IC packages for a number of its customers. The pooling of TEA and PSS resources provides thermal measurement and modeling capability for IC, diode, transistor, LED, and PV devices and related packaging alternatives. … [Read more...]
DoD Extends Contract for Heat Sink Technology
Thermacore was awarded a $3 million Option Phase contract extension by the Defense Advanced Research Projects Agency (DARPA) to continue the development and commercialization of active heat sink technologies for Micro-technologies for Air-Cooled Exchangers (MACE). The original contract had been awarded in December 2008 and is worth $9.5 million. To qualify for the contract … [Read more...]
Circuit Protection Solutions Address New Vehicle Technologies
As electric and hybrid electric vehicles address the world’s energy and emissions crises, automakers and battery manufacturers are rapidly developing new materials and solutions to advance those technologies. Consumer demands and competitive pressures have led automakers to add a growing number of functions and features to their vehicles, which in turn affects … [Read more...]
Groups Develop Thermal Nanotape for Packaging
(a) A nanostructured interface material is used around the module; (b) a nanostructured interface material is used between the thermoelectric material and metal leads. Semiconductor Research Corporation (SRC) and researchers from Stanford University have developed a novel combination of elements that yields a nanostructure material for packaging. The advance could mean … [Read more...]
Novel Thermally Enhanced Power Package
In this paper from Texas Instruments, the authors present a novel power package design that enables heat conduction to the top surface of the microelectronic package through the use of a high thermal conductivity path which reduces by more than a factor of ten the junction-to-top thermal resistance compared to standard solutions. The paper discusses the design, … [Read more...]
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