ITherm 2016 has now opened registration for the conference running from May 31 to June 3, 2016 at the Cosmopolitan Hotel in Las Vegas, Nevada. ITherm 2016 is the leading international conference for scientific and engineering exploration of thermal, thermo-mechanical and emerging technology issues associated with electronic devices, packages, and systems. According to the … [Read more...]
Cooling High-Powered Electronics with Tiny Drops of Water
Lockheed Martin and the Defense Advanced Research Projects Agency (DARPA) Microsystems Technology Office (MTO) want to cool high-powered microchips with microscopic drops of water. “A core team of Lockheed Martin engineers is working on a solution to meet the goal of DARPA’s Inter/Intra Chip Enhanced Cooling (ICECool) program: to enhance the performance of RF MMIC power … [Read more...]
Revolutionary Structure Design Aids in Data Center Cooling
DAMAC, the leading U.S. manufacturer of data center infrastructure equipment, recently unveiled its DAMAC Structure during the Data Center World Global conference in Las Vegas. The structure incorporates an Aisle Containment System, which “encapsulates the aisle way and caps the end of the Structure with the door style of your choice [to] enable human access to the equipment … [Read more...]
NSA Finally Has a Plan for Their Superconducting Supercomputer
The U.S. government has its eyes on “cryogenically cooled circuitry for tomorrow's exascale computers,” reported Spectrum.IEEE.org, a dream over 50 years old. An electrical engineer of the NSA, Dudley Buck, “reported on his own work” in the 1950’s about a “novel superconducting switch he named the cryotron,” according to Spectrum IEEE, and said that “the device works by … [Read more...]
New 2D Semiconductor Performs Better Than Silicon
A team of engineers from the University of Utah have discovered a new 2D semiconducting material that could outperform silicon, making electronics cooler and more efficient. “The semiconductor, made of the elements tin and oxygen, or tin monoxide (SnO), is a layer of 2D material only one atom thick, allowing electrical charges to move through it much faster than conventional … [Read more...]
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