Don’t miss out on the March 2014 issue of Electronics Cooling, which includes the 2014 Buyers' Guide and feature articles on Bitcoin 2-Phase Immersion Cooling and the Implications for High Performance Computing; Ultra-Thin Titanium Based Thermal Solution for Electronic Applications; Potential Pitfalls of Hybrid Electrical-Thermal Measurements for Thermal Characterization; and … [Read more...]
Prehistoric Cave Paint to Shield Solar Spacecraft
A European spacecraft scheduled for launch towards the sun in 2017 will be shielded from extreme temperatures by a type of paint once used in prehistoric cave art. Carrying instruments to perform high-resolution imaging of the sun, the European Space Agency’s Solar Orbiter will travel as close as 42 million kilometers, or a little more than a quarter of the distance to Earth, … [Read more...]
Apple Files Patent for Smaller, Quieter Wireless Cooling Fan
A patent application filed by Apple hints at the company’s latest plan to bypass design limitations and shrink their devices even more. While the technology company strives to develop increasingly lighter and thinner products, certain components limit how thin and light the company can make their devices. One such component is the cooling fan, an essential thermal management … [Read more...]
Research Could Lead to New Thermal Flow Control Devices
Researchers have proposed a new method of controlling heat flow similar to the way electronic components handle electrical current that could deliver more efficient thermal management in a variety of applications. Developed by scientists at Purdue University, the technology utilizes tiny triangular or T-shaped structures made of graphene nanoribbons to control phonons, quantum … [Read more...]
Carbon Nanotubes Boost Microprocessor Cooling
Researchers from the U.S. Department of Energy have developed a new technique that combines carbon nanotubes and organic materials to enable more efficient cooling of microprocessor chips. While carbon nanotubes have long been known to offer high thermal conductivity, widespread application in cooling systems has proven difficult because of their high thermal interface … [Read more...]
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