Don’t miss out on the December 2013 issue of Electronics Cooling, which includes feature articles on Energy-Efficient Warm-Water Cooling of Servers; Thermal Management of Many-core Processors using Power Multiplexing, Characterization of Server Thermal Mass; as well as a calculation corner and technical briefs. If you would like to receive your free copy of Electronics … [Read more...]
Technique Combines Heat Sinks for More Effective Cooling
Researchers at the National University of Singapore have developed a new two-phase technique they say is up to 50 percent more effective in cooling electronic systems compared to current cooling technology. Led by Lee Poh Seng, Ph.D., of the Department of Mechanical Engineering at NUS, the team combined microgap and stepped fin microchannel heat sinks to create a two-phase … [Read more...]
Magnetic Nanoparticles Prevent Hotspots in Cooling Systems
An international team comprised of researchers at MIT and in Australia has discovered a way to enhance heat transfer using magnetic fields, a method they say could prevent hotspots that can lead to system failures. The new system, which relies on tiny particles of magnetite, a form of iron oxide, is the result of several years of research on nanofluids—nanoparticles dissolved … [Read more...]
Heat Sink Watch Helps Wearer Manage Body Temperature
Four engineering students at MIT have developed a thermoelectric bracelet designed to help wearers maintain a comfortable body temperature. Resembling a wristwatch, the invention, known as Wristify, monitors air and skin temperature and sends pulses of hot or cold waveforms to the wrist when needed to help the wearer maintain thermal comfort. A custom copper-alloy-based heat … [Read more...]
Defense Contractors to Develop Next-Gen Military Electronics Thermal Management
U.S. Air Force officials have awarded multimillion dollar contracts to BAE Systems and Boeing Co. as part of DARPA’s Intrachip/Interchip Enhanced Cooling Applications (ICECool Applications) program. The ICECool program seeks to develop advanced electronics cooling techniques for high-performance embedded computer (HPEC) and RF monolithic microwave integrated circuit (MMIC) … [Read more...]
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