A new method of cooling extremely hot surfaces more effectively from researchers at MIT could benefit industrial equipment and electronic devices. Considered by many to be a quieter, more efficient way of removing heat compared to traditional air cooling methods, liquid cooling is commonly used in a number of applications such as internal combustion engines in vehicles and … [Read more...]
Waterproof Tablet Computer Features Cooling Fan
Electronics manufacturer Fujitsu has released a unique new tablet computer capable of operating underwater while using a cooling fan to pump heat away from sensitive internal circuitry. The Arrows Tab QH77/M is 2-in-1 computer that can be used both as a clamshell notebook computer and as a tablet computer when the display unit is detached. The casing houses an Intel Core … [Read more...]
'On-Demand' Nano-sized Heat Sinks Lower IC Temperatures
Scientists at RMIT University in Australia have released research that demonstrates a new method of heat dissipation on the nanoscale level. In a paper published in the online journal Advanced Energy Materials, Kourosh Kalantar-zadeh, a professor at the School of Electrical and Computer Engineering, and his colleagues demonstrate the “on-demand” creation of tiny nanofin heat … [Read more...]
View our Webinar and Q&A on ‘Advanced Carbon-Based Thermal Management Materials and Applications ’
On September 25, 2013, Carl Zweben presented a live webinar on Advanced Carbon-Based Thermal Management Materials and Applications. Overview: In this webinar, we consider advanced carbonaceous (carbon-based) materials, which are now well established, and are being used in a large and increasing number of commercial and aerospace/defense applications. Examples include various … [Read more...]
Webinar Question & Answers
Editor’s note: These questions were asked in response to Electronics Cooling’s recent webinar by Carl Zwebin. To view the webinar, click here. Question: Al/SiC is an attractive material. Is there a need for other new composites? Answer: There is no one universal material. There is a need for low-CTE materials with thermal conductivities higher than those of … [Read more...]
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