A breakthrough demonstration of heat dissipation at the atomic scale by an international research team could help scientists overcome major technological hurdles in the development of smaller, more powerful electronics. Heat—produced when a current passes through a conductive material—remains a major obstacle in the continuing development of smaller, faster, more reliable … [Read more...]
Rand Worldwide Acquires Thermal Simulation Services Provider
Professional services and technology company Rand Worldwide, Inc., has announced the acquisition of Informative Design Partners, a provider of computational fluid dynamics analysis consulting and thermal simulation services. “This acquisition follows on the heels of the recent Simulation Specialization designation that we received from Autodesk and allows us to offer a more … [Read more...]
“Transverse” Thermoelectric Effect May Lead to Better Cooling Devices
Northwestern University researchers are investigating the possibility of vertical heat transport for better cooling devices. A new paper published in Physical Review Letters by researchers at Northwestern University in Illinois explores the idea of using materials in which heat flows perpendicular to an electric current to develop better devices for cooling … [Read more...]
Micro-Vacuum Technology May Cool Future Smartphone Processors
Researchers from the University of Michigan, Massachusetts Institute of Technology (MIT) and Honeywell International, Inc. have developed microscale vacuum pumps that could lead to tiny, more efficient cooling systems for faster processors in smartphones. Developed as part of DARPA’s Chip-Scale Vacuum Micro Pumps (CSVMP) program, the new microscale vacuum pumps are intended … [Read more...]
Electronics Cooling Announces New Editor
Electronics Cooling is proud to announce the addition of Peter Rodgers to the technical board. Rodgers is currently an associate professor of mechanical engineering at The Petroleum Institute, Abu Dhabi, UAE. He previously worked at the University of Maryland; Nokia (Finland); Electronics Thermal Management, Ltd. (Ireland), and the University of Limerick (Ireland). He is a … [Read more...]
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