DuPont Circuit & Packaging Materials, part of DuPont Electronics & Communications, announced earlier this week that it has increased production at its Hsinchu, Taiwan facility by more than seven times the previous amount to better accommodate demand for its CooLam thermal substrate products. DuPont CooLam thermal substrates are designed to help dissipate heat in LED … [Read more...]
Environmental Regulations and Cloud Computing to Affect Asia-Pacific Data Center Cooling Market
New market analysis from business consulting firm Frost & Sullivan has suggested the data center cooling solutions market in the Asia-Pacific will double by 2018, in part due to the increasing emphasis on data center efficiency and the growing demand for cloud-based services. The report, “Asia-Pacific Data Center Cooling Solutions Market,” estimates the market-generated … [Read more...]
New Method Uses Paper and Inkjet Printer to Create More Heat-Tolerant Carbon Electronics
Researchers at the Max Planck Institute of Colloids and Interfaces in Potsdam-Golm, Germany have developed a simpler and more cost-efficient means of creating microchips for electronics applications using paper and a conventional inkjet printer. The use of flexible, cost-efficient microchips as a replacement for silicon chips, which are more expensive and difficult to make, is … [Read more...]
New Tool Could Provide Better Understanding, Method for More Efficient Thermal Transfer
Researchers from the University of Toronto Engineering in Canada, with assistance from colleagues from Carnegie Mellon University in Pennsylvania, have published new insights into how materials used in electronics transfer heat, which could lead to smaller, more powerful electronic devices capable of more efficient thermal management. According to Dan Sellan and Professor … [Read more...]
U.S. Patent for Two-Stage Enclosure Coolers Awarded
The United States Patent and Trademark Office has awarded U.S. patent No. 8,402,773 to ITW Vortec for its two-stage cooling system Vortex A/C Enclosure Coolers. According to the company, the newly patented Vortex A/C enclosure coolers are large enclosure coolers with a cooling capacity of 5000 BTU/hour and a “unique” two-stage cooling system designed to conserve compressed … [Read more...]
- « Previous Page
- 1
- …
- 54
- 55
- 56
- 57
- 58
- …
- 126
- Next Page »
