A heat spike, resulting from a failed software update, shut down part of the data center responsible for supporting the Hotmail servers and left users unable to access their email for up to 16 hours, Microsoft has reported. Access to the Skydrive cloud storage service and Outlook.com was also affected. The March 12 service outage that denied access to the company’s web-based … [Read more...]
Vibration-Free Cooling Technology to Replace Mechanical Compressors in Sensitive Space Applications
Researchers at the University of Twente in the Netherlands have developed a new technology for cooling optical detectors on spacecraft that could help the sensors better detect weak “space signals” that originate from far-away, extremely cold sources. The new development is part of a project commissioned by the European Space Agency. Current cooling systems use mechanical … [Read more...]
Three-Dimensional Chip-Cooling Technology Could Multiply Heat Removal Tenfold
Researchers from the Georgia Institute of Technology in Atlanta, Ga. have been awarded a $2.9 million Defense Advanced Research Projects Agency (DARPA) contract to develop three-dimensional chip-cooling technology capable of dissipating up to 10 times the amount of heat currently removed by cooling systems used today. The new technology will also need to successfully manage … [Read more...]
New Super-Cooling Technique Brings Quantum Computing Closer to Reality
Scientists at the University of California Los Angeles have developed a new technique for super-cooling molecules by combining two traditional atomic cooling technologies that may prove to be a breakthrough for quantum computing. According to Eric Hudson, a UCLA assistant professor of physics, scientists have only succeeded in creating a few specific kinds of the ultra-cold … [Read more...]
Recording of Live Webinar and Q&A Session – What Burns Me Up
On Mar. 27, 2013, Roger Stout, P.E. of ON Semiconductor presented a live webinar, “What Burns Me Up." Overview: Thermal errors, misconceptions and oversights occur on all levels; from semiconductor packaging, thermocouple theory, and infrared imaging; to cold fusion calorimetry and hot dense-plasma-focus fusion reactor design; to energy efficient architecture, plumbing and … [Read more...]
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