General Electric has announced a partnership with semiconductor company Texas Instruments to manufacture the company’s dual piezoelectric cooling jet technology first unveiled in December 2012. According to General Electric, the dual piezoelectric cooling jet technology is a new energy-efficient method for cooling consumer electronics that is based on technology used to … [Read more...]
Laser Cooling Method is “One Step Closer” to Smaller Medical Devices, “Self-Cooling” Computer Chips
Scientists from Nanyang Technological University (NTU) in Singapore have developed a new laser cooling method that could replace extreme refrigerant-based cooling systems in medical devices and satellite cameras and help develop futuristic computer chips capable of cooling themselves. If we are able to harness the power of laser cooling, it would mean that medical devices that … [Read more...]
Cryogenic Cooler Experiment May Lead to More Affordable and Reliable Version for Cooling Electronics
Scientists from the University of Twente in Enschede, The Netherlands have constructed a micro-sized Joule-Thomson (JT) cryogenic cooler, in an effort to help develop a more affordable and reliable version for cooling electronics. According to the project abstract, published in the Journal of Micromechanics and Microengineering, “Cryogenic temperatures are required for … [Read more...]
Company Acquires Exclusive Licensing Rights for Electric Vehicle Heat Dissipation Process
Electric Moto Corporation, Inc. (EMOT), a developer and manufacturer of zero-emission vehicles and related products, has announced it has acquired exclusive licensing rights for a patented heat dissipation process in electric vehicles. The patent for the heat dissipation process was issued in July 2012 to United States Alternative Energy, LLC (USAE). EMOT has agreed to … [Read more...]
Researchers to Examine Heat Dissipation in Three-Dimensional Integrated Circuits
A team of UT Arlington researchers funded by the National Science Foundation has been formed to examine potential solutions for heat minimization and dissipation in three-dimensional integrated circuits. According to Ankur Jain, assistant professor of mechanical and aerospace engineering at UT Arlington and a member of the research team, the limited amount of available space … [Read more...]
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