Osaka, Japan - Panasonic Corporation announced today that its Industry Company has developed MEGTRON 8[1] Multi-Layer Circuit Board Materials Featuring Low Transmission Loss [2], designed for high-speed communication networking equipment such as routers and switches. The worldwide deployment of the fifth-generation mobile communication system (5G) is fostering the trend of … [Read more...]
Protect Electronic Components with Dam & Fill
Sensitive electronic components mounted on a circuit board often require protection from exposure to harsh environments. While there are several ways to accomplish this, the dam and fill method offers many benefits. Dam-and-filling entails dispensing the damming material around the area to be encapsulated, thereby restricting the flow of the fill from spreading to other parts … [Read more...]
Neograf Solutions’ New Advanced Graphenes Targets Energy Storage Markets
NeoGraf Solutions, a leading developer and manufacturer of high-performance natural and synthetic graphite sheet and powder products, has extended its range of next-generation graphite materials with the launch of Graf-X™ graphene nanoplatelets (GNP) and graphene precursors (GP). Both high-performance additive materials deliver enhanced strength, performance, and reliability in … [Read more...]
Cadence Palladium Z2 Enterprise Emulation Platform Accelerates Microchip’s Data Center Solutions SoC Development
Palladium Z2 Emulation enabled Microchip to achieve 1.5X faster run-time performance and 2X better emulation capacity SAN JOSE, Calif.— Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that Microchip has deployed the Cadence® Palladium® Z2 Enterprise Emulation Platform for the development of their next generation ASIC products targeting high performance and … [Read more...]
New fanSINKS Cool Hot Components in Sizes from 27mm to 70mm
Advanced Thermal Solutions, Inc. (ATS) now provides fanSINKS™ heat sinks for component sizes ranging from 27mm to 70mm square. The wider size range accommodates hot semiconductor components, including FPGAs, ASICS and other package types used in telecomm, optics, test/measurement, military and other applications. ATS fanSINKS™ feature cross-cut, straight aluminum fins. They … [Read more...]
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