(April 21st, 2016) A technique has been found that could allow carbon nanotubes to be used in electronic cooling and as devices in microchips, sensors and circuits in the future. Phys.org reported that the technique “uses a laser and electrical current to precisely position and align carbon nanotubes” to make it a “potential new tool for creating electronic devices out of the … [Read more...]
Application of Diamond Heat Spreaders for the Thermal Management of GaN Devices
Application of Diamond Heat Spreaders for the Thermal Management of GaN Devices Thomas Obeloer*, Bruce Bolliger Element Six Technologies 3901 Burton Drive, Santa Clara, CA 95054 *thomas.obeloer@e6.com Yong Han, Boon Long Lau, Gongyue Tang, and Xiaowu Zhang Institute of Microelectronics, A-STAR, Singapore. Introduction As … [Read more...]
Diamonds May Take Silicon’s Place in Future Smartphones
A startup called Akhan Semi suggests lab-grown diamonds can cool electronics more efficiently than silicon. Silicon costs a lot to keep cool, but lab-grown diamonds could eliminate cooling fans and heat sinks since they already eliminate 90% of the energy lost by silicon, according to Adam Khan, founder and CEO of Akhan Semi, the diamond-making startup. “Because a … [Read more...]
Overcoming Cooling Challenges Downloadable Webinar Now Available
The recent Electronics Cooling with Autodesk CFD Webinar on how to ensure proper cooling as the electronics used in products change and improve is now available for download. Exploring ‘invisible elements’ like airflow and heat transfer, speaker Jim Byrne talks through how to maximize product performance by overcoming common electronics challenges like reduction in product … [Read more...]
Registration for Thermal Conference Opens
ITherm 2016 has now opened registration for the conference running from May 31 to June 3, 2016 at the Cosmopolitan Hotel in Las Vegas, Nevada. ITherm 2016 is the leading international conference for scientific and engineering exploration of thermal, thermo-mechanical and emerging technology issues associated with electronic devices, packages, and systems. According to the … [Read more...]
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