Man Prakash Gupta and Satish Kumar G.W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology INTRODUCTION Due to the growing demands of higher performance and faster computing, the number of cores in a microprocessor chip has been increasing consistently. The transition from single core to multi-core technology has already been observed in the past few … [Read more...]
Use of JEDEC Thermal Metrics in Calculating Chip Temperatures (without Attached Heat Sinks)
Bruce Guenin Assoc. Technical Editor, Electronics Cooling INTRODUCTION JEDEC single-chip package thermal metrics are widely used as a means of characterizing the thermal performance of semiconductor packages. They correlate the peak temperature of a uniformly-heated semiconductor chip (the junction temperature, TJ) with the temperature of a specified region along the heat … [Read more...]
Magnetic Field Created Using Heat in First Magnetic Seebeck Effect Demo
In a research breakthrough, scientists from the École Polytechnique Fédérale de Lausanne (Swiss Federal Institute of Technology in Lausanne) in Switzerland claim to have provided the first evidence ever that it is possible to generate a magnetic field by using heat instead of electricity, a phenomenon known as the Magnetic Seebeck effect or “thermomagnetism.” First observed in … [Read more...]
Patent Covers Methods of Making, Cooling Semiconductor Packages
The U.S. Patent and Trademark Office has awarded patent No. 8,546,935, “Semiconductor Packages,” to Micron Technology, Inc. of Boise, Idaho. According to background information provider by the inventors, the patent covers “semiconductor packages having grooves within a semiconductor die backside, and includes semiconductor packages utilizing carbon nanostructures (such as, for … [Read more...]
Discovery Could Change Textbook Models on Heat Transfer
A new discovery in the physics of heat transmission along nanowires could rewrite the models of heat transfer in current textbooks and bring major changes to the electronics industry. Researchers at the National Taiwan University’s Center for Condensed Matter reportedly found ballistic thermal conduction by phonons at room temperature along silicon-germanium nanowires. While … [Read more...]
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