Mersen has completed the acquisition of Eldre as part of Mersen’s strategy to support its partners in the development of the power electronic application market with the critical components that improve system reliability and safety. Mersen’s expanded product offering combines product expertise in laminated busbar, cooling, and semiconductor fuses with application knowledge to … [Read more...]
ElectronicsCooling December 2011 Issue
Don’t miss out on the December 2011 issue of ElectronicsCooling, which includes feature articles on data center design, electro-thermal simulation of power, energy reduction and performance maximization as well as technical briefs. If you would like to receive your free copy of ElectronicsCooling click here to subscribe. Download the December 2011 issue here. … [Read more...]
Companies Team Up to Develop Adhesives to Create 3D Semiconductors
3M and IBM plan to jointly develop the first adhesives that can be used to package semiconductors into densely stacked silicon “towers.” The companies are aiming to create a new class of materials, which will make it possible to build commercial microprocessors composed of layers of up to 100 separate chips. Such stacking would allow for dramatically higher levels of … [Read more...]
Forced Convection Heat Sink Thinner than a Credit Card
Novel Concepts, Inc. has developed and has patents pending for the world's thinnest forced convection (fan cooled) heat sink dubbed ThinSink™. Thinner than a credit card, this low profile ThinSink cools integrated circuits, semiconductors, LEDs and other microelectronic heat generating devices. ThinSink has an amazing thermal performance of 2.73°C/W (degrees Centigrade per … [Read more...]
Connector/Decoupler Integrated in a Heat Sink
United States Patent no. 7,898,078, issued on March 1, was assigned to International Business Machines Corp. Two sets of conductor fins are formed on a topmost surface of stacked semiconductor chips are electrically isolated from each other and function as radiators that dissipate heat from the stacked semiconductor chips. Conductive wiring structures are formed on each set of … [Read more...]
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