JEDEC has approved a thermal transient testing-based measurement methodology inspired by an original idea published jointly by Mentor Graphics Corporation’s MicReD® group and the Automotive Power Application group of Infineon in 2005. This newly published JESD51-14 standard is titled “Transient Dual Interface Test Method for the Measurement of the Thermal Resistance … [Read more...]
Evaluation Method for Thermoelectrical Cooling Systems
IEC/TS 62610-3 ed1.0 -- Mechanical structures for electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series - Part 3: Design guide: Evaluation method for thermoelectrical cooling systems (Peltier effect). IEC/TS 62610-3:2009(E) provides an evaluation method for thermoelectrical cooling systems (Peltier effect). With this design … [Read more...]
Surface Flatness
Surface flatness is an important issue for thermal designers as it is directly related to thermal contact resistance between surfaces. In this column, the definitions of surface flatness related parameters are discussed. These definitions are presented here as in the ASME B46.1-1995 standard [1]. Surfaces are characterized by three main parameters: roughness, waviness, and … [Read more...]
The 45° Heat Spreading Angle – An Urban Legend?
Ever hear about the 45° heat spreading angle? Most of us have. However, no one I've talked to seems to know where it came from. Is it an urban legend, such as alligators in the sewers of Manhattan, or is it an eternal truth deposited into the collective subconscious of the thermal engineering community? However fascinating it might be to explore the historical origins of this … [Read more...]
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