Introduction Forced air cooling remains essential for dissipating the heat generated by high-power-density devices in modern electronics [1]. Axial fans are widely used in information technology, telecommunications, automotive, and aerospace applications for air cooling. The aerodynamic performance (P-Q) curve of fans is essential for designing and optimizing air cooling … [Read more...]
Hydraulic and Thermal Characteristic of a Double-Sided Cold Plate. Part 1: CFD Analysis
Introduction Many programs geared toward the design of autonomous vehicles have been initiated in recent years. Waymo, Cruise, Baidu, Argo AI, Uber, Lyft, and Tesla are among the innovative self-driving car companies. Advances in autonomous technologies will require enhanced thermal protection of critical electronics to ensure optimized performance, health, and … [Read more...]
Guide to Simulation of Vapor Chambers as Anisotropic Conduction Heat Spreaders
Introduction Vapor chambers are passive two-phase devices used to spread heat from localized hotspots to larger surface areas. The device utilizes the latent heat of evaporation of an internal fluid to passively transport heat from the evaporator (heat source) to the condenser (heat sink) across very low-temperature drops. Condensed liquid returns to the evaporator from the … [Read more...]
Digital Edge Specifies Nortek’s StatePoint® Liquid Cooling Technology for Upcoming Philippines Data Center
Digital Edge (Singapore) Holdings Pte. Ltd., (“Digital Edge”), a leading Asian data center developer and operator, leverages StatePoint® liquid cooling technology manufactured by Nortek Data Center Cooling™, Oklahoma City, for its Manila, Philippines, colocation data center. Using the patented StatePoint technology - an industry-leading sustainable cooling solution for … [Read more...]
Mechanical Cycling Reliability Testing of TIMs Developed Specifically for Semiconductor Test
KEYWORDS Thermal Resistance | Thermal Interface | Semiconductor Test | Durability | Cycling | Device Under Test NOMENCLATURE DUT Device Under Test OSAT Out-Sourced Assembly and Test Rth Thermal Resistance S/TB Semiconductor Test and Burn-In TIM Thermal Interface Material ABSTRACT Many thousands of thermal interface materials (TIMs) exist due to the very wide … [Read more...]
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