Abstract The past two decades have seen many approaches to solder fatigue and solder joint life published. This subject has proved difficult as various failure mechanisms are proposed and examined. While these theoretical bases are discussed, it often leaves the end developer in a difficult situation as to how to apply an accurate simulation approach to fatigue failure for a … [Read more...]
A New Patented Approach to Diffusion Bonding Offers Speed and Improved Process Control
An innovative process is reducing diffusion bonding time of aluminum and aluminum alloys by up to 50%, energy use by 30%, and improving quality. Contract manufacturers and design engineers in the aerospace, semiconductor, high-power electronics, and energy industries have been turning to diffusion bonded metals to produce new cutting-edge innovations. Diffusion bonding is … [Read more...]
Pfannenberg USA Introduces PTF 1200 High CFM Top-Mounted Filter Fan
Lancaster, NY – Pfannenberg, Inc., a global leader in thermal management and signaling technologies, proudly introduces the PTF 1200, an industry leading high CFM top-mounted filter fan designed to redefine cooling solutions for various industries. This compact yet powerful innovation boasts an unimpeded airflow rate of up to 589 CFM, making it a game-changer in the realm of … [Read more...]
Theta-JC Measurements: Steady-State Compared to Transient Methods
Thermal characterization plays a vital role in electronic package reliability testing, design, and verification of manufacturing processes. The reliability of electronic packages is controlled, in part, by ensuring the maximum junction temperature is not exceeded during operation. Systems such as cell phones, electric vehicles and computers, must operate with die temperatures … [Read more...]
A Non-Contact Measurement Method for Thin Vapor Chambers by Photonic Technologies
Introduction In recent years, integrated circuit chips have enabled increasingly powerful computing capabilities as advanced process nodes have moved from DUV (deep ultra-violet) to EUV (extreme ultra-violet) lithography, allowing for higher fabrication resolution and transistor density. Additionally, advanced multi-die packaging has seen increased market demand. As a … [Read more...]
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