HP has recently released the world’s thinnest laptop – the Spectre 13.3” notebook, which cools its CPUs with what HP calls ‘hyperbaric cooling technology’. This system features two ultra-thin fans, a heat-pipe, and a special copper radiator, according to AnandTech.com. “The fans intake cool air from the outside and create significant air pressure inside the chassis to blow … [Read more...]
New Energy Efficient Air-to-Air Outdoor Cooler Released
Laird has released its new air-to-air outdoor cooler, the AA-480 Series, that is smaller and more energy efficient than similar units on the market. The cooler has “480 Watts of cooling power and a Coefficient of Performance (COP) rating of 1, and an operating temperature range of -40°C to +55°C,” according to the company, “It has been designed to pass Telcordia test … [Read more...]
Diamonds May Take Silicon’s Place in Future Smartphones
A startup called Akhan Semi suggests lab-grown diamonds can cool electronics more efficiently than silicon. Silicon costs a lot to keep cool, but lab-grown diamonds could eliminate cooling fans and heat sinks since they already eliminate 90% of the energy lost by silicon, according to Adam Khan, founder and CEO of Akhan Semi, the diamond-making startup. “Because a … [Read more...]
New Refrigerant-Based Rack and Row Cooling Solution for IT Equipment
Rittal Corporation has recently introduced a new refrigerant-based rack and row cooling solution, LCP DX, for heat removal of critical IT components. The Rittal Rack LCP DX “puts the cooling only where needed to protect valuable IT equipment while minimizing energy costs” and “includes air-flow optimized enclosures with includes baffles and blanking panels,” said the … [Read more...]
Registration for Thermal Conference Opens
ITherm 2016 has now opened registration for the conference running from May 31 to June 3, 2016 at the Cosmopolitan Hotel in Las Vegas, Nevada. ITherm 2016 is the leading international conference for scientific and engineering exploration of thermal, thermo-mechanical and emerging technology issues associated with electronic devices, packages, and systems. According to the … [Read more...]
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