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Electronics Cooling

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Comparison of HPC and Telecom Data Center Cooling Methods by Operating and Capital Expense Extended Article

 

Dr. Alexander Yatskov Thermal Form & Function Inc.  Introduction  Current high-performance computing (HPC) and Telecom trends have shown that the number of transistors per chip has continued to grow in recent years, and data center cabinets have already surpassed 30 kW per cabinet (or 40.4 kW/m2) [1]. It is not an unreasonable assumption to expect that, in accordance … [Read more...]

Filter Fans Provide Effective Cooling for Electrical and Electronic Enclosures

 

EIC Solutions, Inc., a manufacturer of thermoelectric air conditioners, electronic enclosures and transit cases, has introduced a new line of filter fans designed to remove unwanted heat from electrical/electronic enclosures and cabinets. The VFF series filter fans cool enclosures to a level slightly above the ambient temperature outside the cabinet by drawing filtered ambient … [Read more...]

Advances in Vapor Compression Electronics Cooling

 

INTRODUCTION Over the last 10 years, there has been a well-documented increase in the energy density of electronic devices.  As this­­ energy density has gone up, so has the heat dissipation on electronics packages. In response to this challenge, significant research has taken place to develop chip level cooling systems to meet heat fluxes in excess of 1000W/cm2. As stated … [Read more...]

Relationship between Supply Flow Rate of Small Cooling Fans and Narrow Flow Passages in High-Density Packaging Electronic Equipment

 

Takashi Fukue and Koichi Hirose Dept. of Mech. Eng., Iwate University Tomoyuki Hatakeyama and Masaru Ishizuka Dept. of Mech. Syst. Eng., Toyama Prefectural University Katsuhiro Koizumi Cosel Co., Ltd. Introduction Forced convection driven by cooling fans is widely used for removing heat from electronic equipment. A net cooling performance of the cooling fans is … [Read more...]

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