Aluminum Oxide (Al2O3) is an important ceramic for the electronics industry. Besides its use as a passivation layer on Silicon, the ceramic is often used as a carrier for thick and thin film passive components and for other small printed circuit boards. A relatively low cost is combined with a relatively high thermal conductivity, especially when compared to FR4 board material. … [Read more...]
Calculating interface resistance
Figure 1. Ceramic Package - Aluminum Heat SinkAssembly Introduction The exposed surface area of many of today's high powered electronic packagesis no longer sufficient for the removal of the heat generated during normaloperation. Heat sinks are a commonly-used, low cost means of increasing theeffective surface area for dissipating heat by means of convective air cooling.While … [Read more...]
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