Introduction Recent advances in mobile communications have enabled large scale development of handheld telecommunication products. Such products include cellular phones, pagers, two-way radios, personal digital assistants (PDAs), and other wireless and wireline equipment. The technological enhancements at device, package, and system levels have resulted in increased … [Read more...]
Experimental evaluation of the local convective heat transfer from configurations of wall-mounted cubes in a channel flow
Figure 1: Sketches of the measurement cube. Introduction Computational fluid dynamics (CFD) codes are frequently used as design tools to predict the thermal processes in electronic circuitry. CFD codes can easily cope with a high level of complexity (component, board and system levels) which makes them attractive to use. However, the thermal and kinematic complexity of the … [Read more...]
Forced convection cooling of airborne electronics
Figure 1. AFT description Fin pitch = 25.01 per in = 985 per mPlate spacing, b = 0.200 in = 5.08 x 10-3 m Fin Length = 0.111 in = 2.8 x 10-3 m Flow passage hydraulic diameter 4rh = 0.004905 ft = 1.50 x 10-3 m Fin metal thickness = 0.004 in = 0.102 x 10-3 m Total heat transfer area/volume between plates, ß = 719.4 ft2 / ft3 = 2,360 m2 / m3 Fin area / total area = … [Read more...]
A simple method to estimate heat sink air flow bypass
Introduction After selecting or designing a heat sink based upon a given air velocity orvolumetric flow rate through the fins, the thermal designer needs to determinethe total amount of flow which must be delivered in the duct or card passagecontaining the module w with heat sink. As shown in Figure 1, some of the flowwill go around or bypass the heat sink. In fact, depending … [Read more...]
DELPHI – A status report on the European -union funded project for the creation and validation of thermal models on electronic parts
The accurate prediction of the operating temperatures of critical electronicparts at the component-, board- and system-level is seriously hampered by thelack of reliable, standardised input data. The DELPHI project is addressing thisproblem by the development and experimental validation of thermal models of avariety of `generic' electronic parts. DELPHI (which stands for … [Read more...]
