When used with an SR-54 Series programmable temperature controller, the Tunnel Series thermoelectric assemblies (TEAs) provides precise temperature control with condensation protection for applications below dew point. April 30, 2018 -- Global technology leader Laird (LRD: London) has expanded its thermoelectric assembly (TEA) product offering to better support heating and … [Read more...]
Increasing Adoption of Cryocoolers in the Semiconductor Industry driving the growth of Cryocoolers Market
The report "Cryocooler Market by Type (GM, PT, JT, Stirling, and Brayton Cryocoolers), Services (Technical Support, Repair, Preventive Maintenance), Heat Exchanger Type (Recuperative and Regenerative), Application, and Geography - Global Forecast to 2022". The global cryocooler market is projected to reach USD 2.99 Billion by 2022, at a CAGR of 7.00% between 2017 and 2022. … [Read more...]
Integrated Nano-enhanced Thermal Management Techniques May Boost Photovoltaic Efficiencies
With solar energy systems growing in popularity and adoption across the globe, methods for enhancing the efficiency and power density of solar cells are a hot topic for renewable energy research labs. Essentially all photovoltaic technologies currently available suffer from reduced efficiency when operating at higher than nominal temperatures. In an attempt to reduce the … [Read more...]
The Junction-to-Case Thermal Resistance: A One-Dimensional Underachiever in a Three-dimensional, Conjugate Heat Transfer World
INTRODUCTION As integrated circuits were becoming more widespread in the 1980’s, most of the developmental problems had to do the with electrical operation of the devices and not so much on cooling them, due to low power levels. It was the electrical engineers who did the functional testing, an activity that ultimately expanded to include thermal testing. Even the thermal … [Read more...]
Beat the Heat in 3D Chip Stacks with Embedded Cooling
by: Pritish R. Parida, Mark Schultz & Timothy Chainer J. Watson Research Center, Yorktown Heights NY, USA INTRODUCTION In the Moore’s Law race to keep improving computer performance, the IT industry has turned upward, stacking chips like nano-sized 3D skyscrapers. But those stacks, like the law they’re challenging, have their limits, due to overheating. A solution … [Read more...]
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