Introduction: Evolution of Air and Water Cooling for Electronic Systems Since the development of the first electronic digital computers in the 1940s, efficient removal of heat has played a key role in insuring the reliable operation of successive generations of computers. In many instances the trend toward higher circuit packaging density to provide reductions in circuit delay … [Read more...]
A Cryocooler In Your Laptop Computer? Maybe…
Introduction A review of the technical and market impediments overcome in the development and eventual acceptance of cryocoolers for space-borne applications may shine light on the prospects for the use of such mechanical refrigeration systems in more widespread commercial uses. This premise is explored by first reviewing space cooler development history, then considering some … [Read more...]
Thermal Optimization And Design For Manufacturability Of Liquid-Air Hybrid Cooling Systems
Introduction Existing technologies typically utilize air to carry the heat away from a heat sink that is thermally coupled to the microprocessor. Higher performance devices such as workstations, "gaming" PCs, or tower servers that utilize components with greater power dissipation can require more aggressive cooling technology. A high-performance alternative to heat sinks is a … [Read more...]
2U Rack Mountable Vapor Compression Cooling System For High Power Electronics
Vapor compression refrigeration has long been used to cool telecommunications equipment and some high performance computers. On the whole, however, its usage has been confined to high-value, relatively large, and stationary applications. The advantages of vapor compression cooling (VCC) systems are fairly well known. They can provide heat sinks at below ambient temperatures … [Read more...]
A Practical Implementation Of Silicon Microchannel Coolers
Introduction More than twenty-five years ago, Tuckerman and Pease first described the use of silicon microchannel cooling for very high power densities [1]. However, the coolers could not be fabricated easily and pressure drops were very high. As chip power densities are now increasing beyond air cooling limits, a variety of liquid cooling methods are being investigated. Due to … [Read more...]
- « Previous Page
- 1
- …
- 47
- 48
- 49
- 50
- 51
- …
- 56
- Next Page »
