The recent Electronics Cooling with Autodesk CFD Webinar on how to ensure proper cooling as the electronics used in products change and improve is now available for download. Exploring ‘invisible elements’ like airflow and heat transfer, speaker Jim Byrne talks through how to maximize product performance by overcoming common electronics challenges like reduction in product … [Read more...]
Registration for Thermal Conference Opens
ITherm 2016 has now opened registration for the conference running from May 31 to June 3, 2016 at the Cosmopolitan Hotel in Las Vegas, Nevada. ITherm 2016 is the leading international conference for scientific and engineering exploration of thermal, thermo-mechanical and emerging technology issues associated with electronic devices, packages, and systems. According to the … [Read more...]
Pause On Boiling May Lead to Next-Gen Tech for Thermal Management
A Professor at Syracuse University, Shalabh Maroo, his research group, and collaborators at NIST and RPI have “created a single vapor bubble in a pool of liquid that can remain stable on a surface for hours, instead of milliseconds," reported Nanowerk.com. The group used a focused laser beam to put boiling on pause, which will give researchers “the time necessary to … [Read more...]
Quantum Heat Transfer Proven Possible Over Long Distances
A research group at Aalto University, Finland, has discovered a way to efficiently cool down quantum processors without disturbing computer operations. According to Phys.org, the scientists, led by quantum physicist Mikko Möttönen, transported heat faster than has ever been done with electrons, the usual choice of heat carrier, by using photons instead. “In the QCD Labs in … [Read more...]
Nominations Open for IEEE ITherm Achievement Award
The biennial ITherm Achievement Award is open for nominations for 2016. The Award is presented in recognition of significant contributions made in thermal and thermomechanical management of electronics, of pioneering and sustaining electronics thermal/thermomechanical research contributions, of service to the electronics thermal/thermo-mechanical management community, and of … [Read more...]
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