Dr. Alexander Yatskov Thermal Form & Function Inc. Introduction Current high-performance computing (HPC) and Telecom trends have shown that the number of transistors per chip has continued to grow in recent years, and data center cabinets have already surpassed 30 kW per cabinet (or 40.4 kW/m2) [1]. It is not an unreasonable assumption to expect that, in accordance … [Read more...]
The Holy Books of Heat Transfer: Facts or Fairy Tales
By: Clemens J.M. Lasance; Guest Editor The answer to the question stated in the title is both! It all depends on whether or not your situation is truly similar to the situation described in the book (physically congruent, fluid mechanically and thermally similar). Very few heat transfer books provide detailed dimensions and flow conditions for the experimentally observed … [Read more...]
Data Center Energy Savings: Total Liquid Cooling Versus Indirect Liquid Cooling
By: Yong Quiang Chi, Peter Hopton and Keith Deakin, Iceotope Ltd Jonathan Summers, Alan Real, Nik Kapur and Harvey Thompson, University of Leeds Introduction Improvements in energy efficiency and performance of data centers are possible when liquid is supplied to the racks [1]. A solution which has become popular for dense racks is the rear-door water-cooled heat … [Read more...]
Comparison of HPC and Telecom Data Center Cooling Methods by Operating and Capital Expense
By: Dr. Alexander Yatskov; Thermal Form & Function Inc. Introduction Current high-performance computing (HPC) and Telecom trends have shown that the number of transistors per chip has continued to grow in recent years, and data center cabinets have already surpassed 30 kW per cabinet (or 40.4 kW/m2) [1]. It is not an unreasonable assumption to expect that, in accordance … [Read more...]
Circuit Credit Card Assembly Heat Sinks Embedded with Oscillating Heat Pipes
Joe Boswell, Chris Smoot, Elliot Short, Nate Francis Introduction In this study, lightweight two-phase heat sinks embedded with the Oscillating Heat Pipe (OHP) technology are developed for the thermal management of military circuit card assemblies (CCA). OHP-embedded heat sinks efficiently transport heat generated by CCA centrally located components to the assembly’s … [Read more...]
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