(April 7th, 2016) New work by researchers at Stanford University and the University of Illinois at Urbana-Champaign, suggest that “metal inverse opals” could be used to cool down electronic devices as well as other thermal management applications. Nanotechweb.org explained that “these materials are metal films that contain a periodic arrangement of interconnected spherical … [Read more...]
iNEMI ROADMAP IDENTIFIES TRENDS IMPACTING ELECTRONICS THERMAL MANAGEMENT
iNEMI ROADMAP IDENTIFIES TRENDS IMPACTING ELECTRONICS THERMAL MANAGEMENT PREFACE The International Electronics Manufacturing Initiative (iNEMI) is an industry-led consortium of approximately 100 leading electronics manufacturers, suppliers, associations, government agencies and universities. One of iNEMI’s key initiatives is its biennial roadmap, which looks at the … [Read more...]
New Market Entry of Sealed Enclosure Coolers
As their “first step” into the sealed enclosure cooling market, Advanced Cooling Technologies (ACT) has recently launched its HSC, HPC and LNC series of sealed enclosure cooler products. ACT said this about each of their new products: “ACT’s HSC series of coolers are based on a patent pending design that utilizes the air impingement technology that is thermally efficient and … [Read more...]
World’s Thinnest Laptop Runs on ‘Hyperbaric’ Cooling
HP has recently released the world’s thinnest laptop – the Spectre 13.3” notebook, which cools its CPUs with what HP calls ‘hyperbaric cooling technology’. This system features two ultra-thin fans, a heat-pipe, and a special copper radiator, according to AnandTech.com. “The fans intake cool air from the outside and create significant air pressure inside the chassis to blow … [Read more...]
Registration for Thermal Conference Opens
ITherm 2016 has now opened registration for the conference running from May 31 to June 3, 2016 at the Cosmopolitan Hotel in Las Vegas, Nevada. ITherm 2016 is the leading international conference for scientific and engineering exploration of thermal, thermo-mechanical and emerging technology issues associated with electronic devices, packages, and systems. According to the … [Read more...]
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