Dr. Alexander Yatskov Thermal Form & Function Inc. Introduction Current high-performance computing (HPC) and Telecom trends have shown that the number of transistors per chip has continued to grow in recent years, and data center cabinets have already surpassed 30 kW per cabinet (or 40.4 kW/m2) [1]. It is not an unreasonable assumption to expect that, in accordance … [Read more...]
Comparison of HPC and Telecom Data Center Cooling Methods by Operating and Capital Expense
By: Dr. Alexander Yatskov; Thermal Form & Function Inc. Introduction Current high-performance computing (HPC) and Telecom trends have shown that the number of transistors per chip has continued to grow in recent years, and data center cabinets have already surpassed 30 kW per cabinet (or 40.4 kW/m2) [1]. It is not an unreasonable assumption to expect that, in accordance … [Read more...]
Circuit Credit Card Assembly Heat Sinks Embedded with Oscillating Heat Pipes
Joe Boswell, Chris Smoot, Elliot Short, Nate Francis Introduction In this study, lightweight two-phase heat sinks embedded with the Oscillating Heat Pipe (OHP) technology are developed for the thermal management of military circuit card assemblies (CCA). OHP-embedded heat sinks efficiently transport heat generated by CCA centrally located components to the assembly’s … [Read more...]
Advances in Vapor Compression Electronics Cooling
INTRODUCTION Over the last 10 years, there has been a well-documented increase in the energy density of electronic devices. As this energy density has gone up, so has the heat dissipation on electronics packages. In response to this challenge, significant research has taken place to develop chip level cooling systems to meet heat fluxes in excess of 1000W/cm2. As stated … [Read more...]
Heat Pipe Assembly for Spacecraft and Hypersonic Vehicles Passes NASA Hypersonic Tests
Advanced thermal solutions provider Thermacore has announced that its heat pipe assembly recently completed testing at the NASA Ames Arc Jet Complex operating at very high temperatures in a hypersonic leading edge simulation, making it the first rigid embedded heat pipe module to operate successfully at those conditions. The demonstration confirms that the embedded heat-pipe … [Read more...]
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