The R6850-PM2D1GD5, part of the R6800 series of graphics cards recently launched by mainboard and graphics card manufacturer MSI, uses direct contact heat pipes to more efficiently cool the GPU. A 9cm PWM fan provides 50% more airflow compared to the reference design. Overall, this results in 10% lower temperatures of the graphics core. The MSI R6800 series of graphics cards … [Read more...]
Apple Gets Patent on Method of Cooling Electronic Devices
Apple Inc., maker of the iPhone and the iPad, received a patent on a method of cooling an electronic device by using hinge assemblies that can conduct heat. Patent 7,746,631, which was issued June 29, covers the use of a variety of cooling components within a hinge assembly. According to the patent, these could include fans, heat sinks, heat spreaders, heat pipes, vents or … [Read more...]
integrating vapor chambers into thermal solutions
Introduction Often in high power density or low profile heat sink applications, the spreading resistances in the base of the heat sink limits the performance of the design. Once it is determined that normal heat sink materials, aluminum or copper, are either insufficient or too bulky to meet the design objectives, the obvious next step is to look at two phase … [Read more...]
Integrated Heat Pipe Spreader for Improved FBDIMM Memory Module Thermal Management
Introduction Due to the increasing power density in today's industry standard servers, thermal design and cooling is a significant challenge. In a typical server, the two most challenging elements to cool are the processors and the memory modules. The system level fan speeds are directly dictated (in most cases) by both processor and memory temperatures. Due to the fact that … [Read more...]
Pushing the Boundaries of Heat Pipe Operation
Introduction Heat pipes are well-established two-phase devices used in the electronics cooling industry to transport heat from the point it is generated to the place where it is extracted from the system. Three wick structures are most commonly used to provide the capillary path for the liquid return to evaporation section; these are sintered powder, screen mesh and grooved … [Read more...]
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