Heat transfer in electronic packages is a complex problem involving a network of resistive paths for the various laminated structures, bonding adhesives, lead frames, and attachment mechanisms, such as ball grid arrays. However, despite the multitude of materials and interfaces within an electronic package, the largest thermal resistance, and consequently the controlling … [Read more...]
Heat pipe fundamentals
The use of heat pipes in thermal management is increasing rapidly as power densities in electronics continue to rise. Heat pipes are attractive because they can typically carry 100 or more times as much heat as an equivalent piece of solid copper. The basic principle of heat pipe operation is very simple. A small amount of working fluid, typically water, is sealed inside a … [Read more...]
Heat Pipes for Electronics Cooling Applications
Figure 1: Heat pipe operation Introduction All electronic components, from microprocessors to high end powerconverters, generate heat and rejection of this heat is necessary for theiroptimum and reliable operation. As electronic design allows higher throughputin smaller packages, dissipating the heat load becomes a critical design factor. Many of today's electronic devices … [Read more...]
Thermal control of space electronics
Introduction Telecommunication satellites are all based on the same overall design usinga 3 axis stabilization process, in which the North and South panels act asradiators and so ensure heat removal. This basic principle is illustrated in Figure 1. The ever-increasing demandfor national and international space-based communications in parallel with theevolution of space … [Read more...]
Applying computational fluid dynamics to heat sink design and selection
Abstract This article describes how Computational Fluid Dynamics (CFD) can help inthe selection and/or design of a heat sink for electronics cooling applications.CFD modeling complements the other tools in the thermal tool kit: calculationsbased on approximations and correlations; and experimental work. Whether theapplication includes single or multiple heat sinks, the … [Read more...]
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